Semi-Conducting Compound For Breakouts

Description:
Semi-conducting Compound is a deformation resistant compound designed for jointing breakouts. The compound is characterized by its good stress crack resistance, balanced volume resistivity and excellent processability.


Technical Characteristics:

Property

Test Method

Unit

Typical Value

Density

ASTM-D-792

Gm/cc

1.12

MFI at 190 ᵒC / 5 kg

ASTM-D-1238

Gm/10 min

0.91

Tensile Strength

ASTM-D-638

Kg/cm.sq

125

Elongation at Break

ASTM-D-638

%

300

Heat Distortion Temperature

ASTM-D-648

ᵒC

62

Heat Shock Test, 130 ᵒC, 4 hrs

PPIL-Std.

No Flow/ No Crack

No Flow/ No Crack

Vicas Softening point

ASTM-D-1525

ᵒC

96

ESCR, 50 ᵒC (10% Igepol Solution

ASTM-D-1693

Hr

> 100

Volume Resistivity

ASTM-D-257

Ohm.cm

250

Application:
Semi-conducting compound is suitable as shielding materials for jointing breakouts. It is rated for 90 ᵒC continuous service and 130 ᵒC overload temperature.
Recommended Extrusion Conditions
Extrusion: The compound is extrudable in conventional polyethylene wire and cable extrusion line.
Pre-drying:
Semi-conducting compound shall be pre-dried before use. Usually 3-5 hr drying in dehumidified hopper at 70-80 ᵒC is sufficient unless compound is exposed to atmosphere for long period.
Temperature Profile for Extrusion:
As a guide, the following temperature profile is recommended:

ZONES

1

2

3

4

Head

Die

Temperature

125 ᵒC

130 ᵒC

135 ᵒC

140 ᵒC

145 ᵒC

150 ᵒC

Note:
-This profile may vary depending on extruder type, design and output.
-Based on experience of extrusion in 25 mm single screw extruder.
Screw Cooling :       70 ᵒC
Packing           :           Moisture resistant aluminium laminated bags of 25 kg.
We believe this information is based on the best currently available data on this subject. It is offered as a possible helpful suggestion in experimentation you may care to undertake along these lines. It is subjected to revision as additional knowledge and experience are gained. PPIL makes no guarantee to results and assumes no obligation or liability whatsoever in connection with this information. This publication is not a license to operate under or intended to suggest infringement of any existing patents.